The MEMS design software IntelliSuite provided by our company is a professional software tool for MEMS (Micro Electro Mechanical System), micro-nano field design, simulation and analysis. Process level, system level analysis. Can use finite element, boundary element and other methods to analyze microstructure and multi-physical quantity (field) coupling analysis, including mechanical properties, force, deformation, thermal properties, temperature stress, thermoelectric effect, current, voltage, piezoelectricity, pressure Static, dynamic, frequency, damping, steady-state and transient analysis of resistive, electromagnetic, microfluidic and other phenomena.

1.  IntelliFab

Combined with materials, layout and process flow, it can be exported to the FabSim module to create a 3D virtual model of the device, and exported to the TEM module for analysis.

• Complete MEMS process flow including deposition, etching, bonding, doping and electroplating. Users can add their own crafts;

• Support standard tape-out process, such as MUMPS, SCREAM, SUMMIT, Bosch Surface Micromachining, LIGA, etc. Users can create their own process templates;

• Support II-V compound semiconductor process;

• Support composite layout lithography process;

• Support SOl material, support the synchronization of resistivity and sheet resistance parameters, support automatic estimation of SiO2 parameters;

• Wet etch rate editing capabilities for patterned silicon and quartz;

• Support the output of Excel format process flow sheet;

• Combined with FabSim to simulate the three-dimensional model of the device after any process step;

• Combined with TEM analysis of the impact on the device, more accurate multiphysics simulations can be achieved;

2. FabViewer

Powerful process demonstration tool based on 3D voxel manipulation.

• Display the technological process in the form of animation; 

• 3D model of the device after simulating any process step;

• Supports most MEMS process simulations, including: isotropic/anisotropic deposition, isotropic/anisotropic etching, wet etching, bonding, photolithography, and oxidation/implantation in CMOS processes;

• Using voxel graphics technology, more realistic demonstration of three-dimensional complex device structure;

• Using volume rendering technology, users can view the internal information of the device through functions such as rotation, translation, zoom, and section;

• Use geometric algorithms to simulate deposition and etching processes more realistically;

3.FabSim

Accurate 3D process physics simulation tool.

• Adopt high-precision physical simulation algorithm to support MEMS and IC processes such as deposition, lithography, etching, and oxide implantation, which is closer to the real process;

• Support high precision mode and fast mode emulation, while providing GPU acceleration function;

• Deep reactive particle etching algorithm based on high precision diffusion equation;

• Wet anisotropic etching algorithm based on high-precision LevelSet, supports a variety of materials, and has strong scalability;

• Supports physical simulation of various compound semiconductor processes such as IVV semiconductors (InP);

• Support spray quasi-isotropic wet etching process;

• 3D voxel graphic display technology, support layered display according to the process, easy to observe the internal structure information of the device;

• Support mesh export, which can be seamlessly connected with the analysis module;

• Support PPT, AVI, JPG, rawiv and other formats output;

4. IntelliEtch

• Accurate wet etching process simulation based on atomic model;

• Integrated DRIE and multiple mask compounding process functions;

• Cellular automata and dynamic Monte Carlo model based on octree and parallel computing;

• Complete etching process database, user-oriented open interface;

• Arbitrary high-index crystal planes can be defined and cut;

• Accurate description of corrosion surface topography;

• Compatible with IntelliMask layout files and Bmp mask files;

• Output FEM grid data;

• ItelliEtchG based on GPU massively parallel computing;

• Wagon Wheel Analyzer silicon etch rate extraction tool;

• Etch Rate Visualizer / CCA calibrator Silicon etch rate visualization and calibration tool;

• Wagon Wheel Analyzer II Quartz Etch Rate Extraction Tool;

   

5. AnisE 

The advanced, automatic control-based unit etching simulation technology can obtain accurate <100>.<110> single crystal silicon wafer KOH and TMAH anisotropic etching simulation results, and can also be used for complex layout and long-term etching.

• Top, bottom and double-sided etching of wafers;

• Multiple cutoff layers and multiple etchings of different masks on a single wafer;

• Reflect the effects of misaligned masks, and compensation techniques;

• Predict the effect of etchant temperature, concentration and etching time on device shape;

• TMAH and KOH etching rate database, users can also customize the etching rate; 

• Determine the effect of vertical etching in the case of coupled anisotropic etching;

• 3D graphics and cross-section visualization;

• Measure the distance and angle between any two points of the wafer after etching;

6. RECIPE 

Simulate the RIE/ICP (Bosch Process) process to clearly reflect how the processing process affects the product molding.
Adjustable side scallops, roughness and period;

• The lag effect of RIE and DRIE;

• Simulate the final solid shape and side angle;

• Consider mask effects;

• Create structures with adjustable process parameters for specific sections;

• Support Footing effect simulation;

• Support process parameter calculation;

• DRIE etching rate and aspect ratio calibration tool;

7. Exposure 
Simulate the MEMS thick-resist physical lithography process, and use the physical simulation algorithm and physical model to accurately reflect the SU8 and other thick-resist lithography effects.

• Support the four-step simulation of image forming, exposure, post-baking, and development;

• Detailed pre- and post-exposure lighting models;

• Support multi-layer mask file layout settings;

• Support fine measurement of 3D display results; 

8. MEMaterial 

The most comprehensive thin-film material database and process optimization tool available today, providing important links between process parameters and device characteristics.

• Contains as many as 70 kinds of common film material properties of MEMS based on real process, making the simulation results more accurate;

• Allow users to add and customize materials;

• Export material properties directly to the TEM analysis module via the InteliFab module;

• Process Optimization;

9. Blueprint 
A design tool dedicated to editing MEMS layouts.

• Multi-layer layout editing function;

• Boolean operations can be performed on the layout;

• A perfect combination of shape and topology;

• Automatically generate the optimal device structure layout;

• Can read files in BMP, JPG, PNG and other image formats; .

• It can automatically generate a series of new units to the specified layer through the existing layer according to certain rules;

• Automatically simplify and cut polygons with too many vertices;

• Ability to draw complex layouts such as ellipses, arcs, irregular curved edges and sinusoids;

• Parameter script editing function: changing device parameters can quickly and easily modify the device structure, greatly shortening the design time;

• Layout script database of various common MEMS devices, including various MEMS sensors, actuators, packaging, testing and pressure devices;

• Modify or create new parameter scripts;

• Create complex layouts using cell-based VBS scripts;

• Complete GDSII file conversion function;

• Compatible with industry mainstream file formats GDSI, MSK, DXF;

• Support DESIGN RULE CHECK;

• Supports various Boolean operations on the layout, which can easily create complex structures;.

• Fully support CELL layered structure;

• Process preview of 3D structures;

• Provide Measurement and Dimensioning Tools, which can easily mark the layout;

10. 3D Builder 
A powerful tool for interactive editing of 3D models of devices.

• Cartesian and polar grid points to assist in creating the optimal model of the device;

• Snap to grid or snap to points (including midpoints, intersections and split points, etc.);

• Input layout (GDS, DXF or VEC format) to optimize the model;

• Mesh subdivision for specified parts, such as spider web, zipper, and divergence;

• Compatible with ANSYS, ABAQUS, PATRAN, I-DEAS formats;

• Able to solve large-scale matrices; .

• Easily modify structural thickness and clearance;

• Automatic verification of mesh quality and correctness;

• The model is directly generated from the 2D layout and divided into hexahedral meshes;

• Automatically correct disconnected meshes (when the number of meshes is small);

• Build sloped meshes;

11. ThermoElectroMechanical (TEM)

It can perform thermal, electrostatic, mechanical, thermo-mechanical-electrical coupling, fluid-structure coupling analysis in different types of static, dynamic, transient and frequency domains.

• Define the stress gradient and add the Coriolis force to the cyclotron;

• Changed FEA questions, unique EFM features;

• Finite element and boundary element solvers;

• High-precision electrostatic drive model;

• Compatible with ANSYS, PATRAN, IDEAS;

• Use the IneliFab module to generate finite element models or use 3DBuilder to generate 3D models of components;

• Take into account the relationship between thermal conductivity, resistivity, thermal expansion coefficient, density and temperature;

• Contact analysis, piezoelectric, piezoresistive and packaging analysis;

• Accurate dynamic analysis of electromechanical coupling to realize dynamic electromechanical coupling simulation based on real 3D device structure;

• The extended piezoelectric analysis function, which includes the charge density in addition to the voltage load, can study the open-circuit performance of the piezoelectric structure,

• FBAR/SAW/BAW designers can quickly calculate serial and parallel resonances through this module, and then calculate the coupling factor;

• Piezoelectric transient and dynamic simulation includes transient voltage differential input, transient charge density input and the influence of SqueezeFilm;

• Eigenfrequency analysis of specified modes;

• The complete finite element model can be obtained by a reduction method - a simplified model which can be used for system level analysis.

• This reduction method is based on Arnoldi reduction method, Lagrangian mechanics and mode superposition;

• Macro model feature extraction, automatic generation of system models with N degrees of freedom. Complete recording of nonlinear dynamic behavior, including harmonic and sub-harmonic responses;

• Create rigid-body models for electronics, or higher-order models that include second-order effects (parasitics, nonlinear deformation, temperature effects, and encapsulation effects) for designing compensated electrical components;

• Provide 32- and 64-bit solvers, support SMP multi-core parallel computing; .

• Static calculation of thermoelectromotive force Seebeck effect;

• Static, frequency and dynamic analysis and calculation of magnetostrictive effect;

12. ParameterAnalysis 
Customizable parametric analysis tools, from layout generation, 3D model mesh establishment, boundary and load settings, to analysis and post-processing, to generate analysis reports.

• Unattended parametric analysis;

• size parameterization;

• Load parameterization;

• Standard cell layout library;

• Customizable units and layouts;

• One-click 3D mesh creation;

• Automatic boundary and load addition;

• The final result report, which can extract the results under any specified parameters;

• A comparison chart of the results under different parameters can be generated;

13. Microfluidic 
for analyzing microfluidics and microscopic phenomena in the field of BioMEMS.

• microchannel flow;

• Electrically driven flow (electroosmosis, electrophoresis);

• Dielectrophoresis (two-dimensional electrophoresis); 

• Ion-driven flow in an electric field; 

• Electrowetting (Electric Field Droplet Surface Tension Driven Simulation), Free Surface Flow;

• Define sliding boundary conditions to simulate plug flow;

• The mixing and separation flow of acid, alkali and weak electrolyte under the action of electric field;

• Convective heat transfer effect;

• Using block-fitted coordinates, it can accurately describe complex geometric models and solve the problem of moving boundaries;

14. EMag Analysis 
Three-dimensional full-wave electromagnetic field analysis module.

• MEMS accurate full wave analysis;

• Real deformation structure analysis;

• Adopt the internationally popular finite element analysis solver;

• Precise boundary condition settings;

• Automatic air filling; .

• Powerful adaptive tetrahedral partitioning;

• Rich electromagnetic material library;

• Multiple matrix equation solvers to choose from, including CG and GMRES;

• Support multi-core parallel computing; .

• Extraction of S-parameters;

• Extraction of impedance matrix;

• Three-dimensional display of electric and magnetic fields;

• Smith chart;

• Support other relevant industrial formats (such as ACIS text format);

• The data format is compatible with other modules of InelliSuite;

15. SYNPLE 
It is a multi-field, multi-scale MEMS and nanotechnology system-level design tool, which is an epoch-making product for effective comprehensive design of devices and circuits. Combined with other modules of InelliSuite, many technical problems in industry can be solved.

• A good extensibility framework, which can easily add new units;

• A flexible way of defining units without learning a new language;

• No need to spend a lot of time to calculate the Jacobian determinant, the calculation speed is significantly better than traditional numerical methods;

• Pre-built cell libraries include analog, digital, hybrid digital-analog, mechanical, and MEMS components. and is constantly being updated;

• The innovative SME (System Model Extraction) can systematically analyze the dynamic characteristics of MEMS devices, extract device characteristic parameters, and convert - a large FEA model into - an accurate N-degree-of-freedom energy model, which can be imported into the SYNPLE module for simulation , and finally obtain results consistent with the full FEA analysis, while the calculation speed is increased by 1000 times;

• mEFM (Multiple Surface Meshing) specially developed for inertial devices such as MEMS gyroscopes and accelerometers

• The algorithm can efficiently and accurately analyze the characteristic parameters of complex comb tooth structure, which greatly improves the operation efficiency;

• Based on the Jiles-Atherton model and the secondary domain rotation model, considering the hysteresis effect of the changing magnetic field, a MEMS unit with magneto-mechanical coupling and magneto-piezoelectric coupling is developed;