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IntelliSuite9.0 technical parameters

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  • Time of issue:2022-06-28
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IntelliSuite9.0 technical parameters

(Summary description)

  • Categories:Software case
  • Author:
  • Origin:
  • Time of issue:2022-06-28
  • Views:382

The MEMS design software IntelliSuite provided by our company is a professional software tool for MEMS (Micro Electro Mechanical System), micro-nano field design, simulation and analysis. Process level, system level analysis. Can use finite element, boundary element and other methods to analyze microstructure and multi-physical quantity (field) coupling analysis, including mechanical properties, force, deformation, thermal properties, temperature stress, thermoelectric effect, current, voltage, piezoelectricity, pressure Static, dynamic, frequency, damping, steady-state and transient analysis of resistive, electromagnetic, microfluidic and other phenomena.

1.  IntelliFab

Combined with materials, layout and process flow, it can be exported to the FabSim module to create a 3D virtual model of the device, and exported to the TEM module for analysis.

  • Complete MEMS process flow including deposition, etching, bonding, doping and electroplating. Users can add their own crafts;
  • Support standard tape-out process, such as MUMPS, SCREAM, SUMMIT, Bosch Surface Micromachining, LIGA, etc. Users can create their own process templates;

  • Support II-V compound semiconductor process;

  • Support composite layout lithography process;

  • Support SOl material, support the synchronization of resistivity and sheet resistance parameters, support automatic estimation of SiO2 parameters;

  • Wet etch rate editing capabilities for patterned silicon and quartz;

  • Support the output of Excel format process flow sheet;

  • Combined with FabSim to simulate the three-dimensional model of the device after any process step;

  • Combined with TEM analysis of the impact on the device, more accurate multiphysics simulations can be achieved;


2. FabViewer

Powerful process demonstration tool based on 3D voxel manipulation.

  • Display the technological process in the form of animation; 

  • 3D model of the device after simulating any process step;

  • Supports most MEMS process simulations, including: isotropic/anisotropic deposition, isotropic/anisotropic etching, wet etching, bonding, photolithography, and oxidation/implantation in CMOS processes;

  • Using voxel graphics technology, more realistic demonstration of three-dimensional complex device structure;

  • Using volume rendering technology, users can view the internal information of the device through functions such as rotation, translation, zoom, and section;

  • Use geometric algorithms to simulate deposition and etching processes more realistically;



Accurate 3D process physics simulation tool.

  • Adopt high-precision physical simulation algorithm to support MEMS and IC processes such as deposition, lithography, etching, and oxide implantation, which is closer to the real process;

  • Support high precision mode and fast mode emulation, while providing GPU acceleration function;

  • Deep reactive particle etching algorithm based on high precision diffusion equation;

  • Wet anisotropic etching algorithm based on high-precision LevelSet, supports a variety of materials, and has strong scalability;

  • Supports physical simulation of various compound semiconductor processes such as IVV semiconductors (InP);

  • Support spray quasi-isotropic wet etching process;

  • 3D voxel graphic display technology, support layered display according to the process, easy to observe the internal structure information of the device;

  • Support mesh export, which can be seamlessly connected with the analysis module;

  • Support PPT, AVI, JPG, rawiv and other formats output;


4. IntelliEtch

  • Accurate wet etching process simulation based on atomic model;

  • Integrated DRIE and multiple mask compounding process functions;

  • Cellular automata and dynamic Monte Carlo model based on octree and parallel computing;

  • Complete etching process database, user-oriented open interface;

  • Arbitrary high-index crystal planes can be defined and cut;

  • Accurate description of corrosion surface topography;

  • Compatible with IntelliMask layout files and Bmp mask files;

  • Output FEM grid data;

  • ItelliEtchG based on GPU massively parallel computing;

  • Wagon Wheel Analyzer silicon etch rate extraction tool;

  • Etch Rate Visualizer / CCA calibrator Silicon etch rate visualization and calibration tool;

  • Wagon Wheel Analyzer II Quartz Etch Rate Extraction Tool;


5. AnisE 

The advanced, automatic control-based unit etching simulation technology can obtain accurate <100>.<110> single crystal silicon wafer KOH and TMAH anisotropic etching simulation results, and can also be used for complex layout and long-term etching.

  • Top, bottom and double-sided etching of wafers;

  • Multiple cutoff layers and multiple etchings of different masks on a single wafer;

  • Reflect the effects of misaligned masks, and compensation techniques;

  • Predict the effect of etchant temperature, concentration and etching time on device shape;

  • TMAH and KOH etching rate database, users can also customize the etching rate; 

  • Determine the effect of vertical etching in the case of coupled anisotropic etching;

  • 3D graphics and cross-section visualization;

  • Measure the distance and angle between any two points of the wafer after etching;



Simulate the RIE/ICP (Bosch Process) process to clearly reflect how the processing process affects the product molding.
Adjustable side scallops, roughness and period;

  • The lag effect of RIE and DRIE;

  • Simulate the final solid shape and side angle;

  • Consider mask effects;

  • Create structures with adjustable process parameters for specific sections;

  • Support Footing effect simulation;

  • Support process parameter calculation;

  • DRIE etching rate and aspect ratio calibration tool;


7. Exposure 
Simulate the MEMS thick-resist physical lithography process, and use the physical simulation algorithm and physical model to accurately reflect the SU8 and other thick-resist lithography effects.

  • Support the four-step simulation of image forming, exposure, post-baking, and development;

  • Detailed pre- and post-exposure lighting models;

  • Support multi-layer mask file layout settings;

  • Support fine measurement of 3D display results; 


8. MEMaterial 

The most comprehensive thin-film material database and process optimization tool available today, providing important links between process parameters and device characteristics.

  • Contains as many as 70 kinds of common film material properties of MEMS based on real process, making the simulation results more accurate;

  • Allow users to add and customize materials;

  • Export material properties directly to the TEM analysis module via the InteliFab module;

  • Process Optimization;


9. Blueprint 
A design tool dedicated to editing MEMS layouts.

  • Multi-layer layout editing function;

  • Boolean operations can be performed on the layout;

  • A perfect combination of shape and topology;

  • Automatically generate the optimal device structure layout;

  • Can read files in BMP, JPG, PNG and other image formats; .

  • It can automatically generate a series of new units to the specified layer through the existing layer according to certain rules;

  • Automatically simplify and cut polygons with too many vertices;

  • Ability to draw complex layouts such as ellipses, arcs, irregular curved edges and sinusoids;

  • Parameter script editing function: changing device parameters can quickly and easily modify the device structure, greatly shortening the design time;

  • Layout script database of various common MEMS devices, including various MEMS sensors, actuators, packaging, testing and pressure devices;

  • Modify or create new parameter scripts;

  • Create complex layouts using cell-based VBS scripts;

  • Complete GDSII file conversion function;

  • Compatible with industry mainstream file formats GDSI, MSK, DXF;


  • Supports various Boolean operations on the layout, which can easily create complex structures;.

  • Fully support CELL layered structure;

  • Process preview of 3D structures;

  • Provide Measurement and Dimensioning Tools, which can easily mark the layout;


10. 3D Builder 
A powerful tool for interactive editing of 3D models of devices.

  • Cartesian and polar grid points to assist in creating the optimal model of the device;

  • Snap to grid or snap to points (including midpoints, intersections and split points, etc.);

  • Input layout (GDS, DXF or VEC format) to optimize the model;

  • Mesh subdivision for specified parts, such as spider web, zipper, and divergence;

  • Compatible with ANSYS, ABAQUS, PATRAN, I-DEAS formats;

  • Able to solve large-scale matrices; .

  • Easily modify structural thickness and clearance;

  • Automatic verification of mesh quality and correctness;

  • The model is directly generated from the 2D layout and divided into hexahedral meshes;

  • Automatically correct disconnected meshes (when the number of meshes is small);

  • Build sloped meshes;


11. ThermoElectroMechanical (TEM)

It can perform thermal, electrostatic, mechanical, thermo-mechanical-electrical coupling, fluid-structure coupling analysis in different types of static, dynamic, transient and frequency domains.

  • Define the stress gradient and add the Coriolis force to the cyclotron;

  • Changed FEA questions, unique EFM features;

  • Finite element and boundary element solvers;

  • High-precision electrostatic drive model;

  • Compatible with ANSYS, PATRAN, IDEAS;

  • Use the IneliFab module to generate finite element models or use 3DBuilder to generate 3D models of components;

  • Take into account the relationship between thermal conductivity, resistivity, thermal expansion coefficient, density and temperature;

  • Contact analysis, piezoelectric, piezoresistive and packaging analysis;

  • Accurate dynamic analysis of electromechanical coupling to realize dynamic electromechanical coupling simulation based on real 3D device structure;

  • The extended piezoelectric analysis function, which includes the charge density in addition to the voltage load, can study the open-circuit performance of the piezoelectric structure,

  • FBAR/SAW/BAW designers can quickly calculate serial and parallel resonances through this module, and then calculate the coupling factor;

  • Piezoelectric transient and dynamic simulation includes transient voltage differential input, transient charge density input and the influence of SqueezeFilm;

  • Eigenfrequency analysis of specified modes;

  • The complete finite element model can be obtained by a reduction method - a simplified model which can be used for system level analysis.

  • This reduction method is based on Arnoldi reduction method, Lagrangian mechanics and mode superposition;

  • Macro model feature extraction, automatic generation of system models with N degrees of freedom. Complete recording of nonlinear dynamic behavior, including harmonic and sub-harmonic responses;

  • Create rigid-body models for electronics, or higher-order models that include second-order effects (parasitics, nonlinear deformation, temperature effects, and encapsulation effects) for designing compensated electrical components;

  • Provide 32- and 64-bit solvers, support SMP multi-core parallel computing; .

  • Static calculation of thermoelectromotive force Seebeck effect;

  • Static, frequency and dynamic analysis and calculation of magnetostrictive effect;


12. ParameterAnalysis 
Customizable parametric analysis tools, from layout generation, 3D model mesh establishment, boundary and load settings, to analysis and post-processing, to generate analysis reports.

  • Unattended parametric analysis;

  • size parameterization;

  • Load parameterization;

  • Standard cell layout library;

  • Customizable units and layouts;

  • One-click 3D mesh creation;

  • Automatic boundary and load addition;

  • The final result report, which can extract the results under any specified parameters;

  • A comparison chart of the results under different parameters can be generated;


13. Microfluidic 
for analyzing microfluidics and microscopic phenomena in the field of BioMEMS.

  • microchannel flow;

  • Electrically driven flow (electroosmosis, electrophoresis);

  • Dielectrophoresis (two-dimensional electrophoresis); 

  • Ion-driven flow in an electric field; 

  • Electrowetting (Electric Field Droplet Surface Tension Driven Simulation), Free Surface Flow;

  • Define sliding boundary conditions to simulate plug flow;

  • The mixing and separation flow of acid, alkali and weak electrolyte under the action of electric field;

  • Convective heat transfer effect;

  • Using block-fitted coordinates, it can accurately describe complex geometric models and solve the problem of moving boundaries;


14. EMag Analysis 
Three-dimensional full-wave electromagnetic field analysis module.

  • MEMS accurate full wave analysis;

  • Real deformation structure analysis;

  • Adopt the internationally popular finite element analysis solver;

  • Precise boundary condition settings;

  • Automatic air filling; .

  • Powerful adaptive tetrahedral partitioning;

  • Rich electromagnetic material library;

  • Multiple matrix equation solvers to choose from, including CG and GMRES;

  • Support multi-core parallel computing; .

  • Extraction of S-parameters;

  • Extraction of impedance matrix;

  • Three-dimensional display of electric and magnetic fields;

  • Smith chart;

  • Support other relevant industrial formats (such as ACIS text format);

  • The data format is compatible with other modules of InelliSuite;


It is a multi-field, multi-scale MEMS and nanotechnology system-level design tool, which is an epoch-making product for effective comprehensive design of devices and circuits. Combined with other modules of InelliSuite, many technical problems in industry can be solved.

  • A good extensibility framework, which can easily add new units;

  • A flexible way of defining units without learning a new language;

  • No need to spend a lot of time to calculate the Jacobian determinant, the calculation speed is significantly better than traditional numerical methods;

  • Pre-built cell libraries include analog, digital, hybrid digital-analog, mechanical, and MEMS components. and is constantly being updated;

  • The innovative SME (System Model Extraction) can systematically analyze the dynamic characteristics of MEMS devices, extract device characteristic parameters, and convert - a large FEA model into - an accurate N-degree-of-freedom energy model, which can be imported into the SYNPLE module for simulation , and finally obtain results consistent with the full FEA analysis, while the calculation speed is increased by 1000 times;

  • mEFM (Multiple Surface Meshing) specially developed for inertial devices such as MEMS gyroscopes and accelerometers

  • The algorithm can efficiently and accurately analyze the characteristic parameters of complex comb tooth structure, which greatly improves the operation efficiency;

  • Based on the Jiles-Atherton model and the secondary domain rotation model, considering the hysteresis effect of the changing magnetic field, a MEMS unit with magneto-mechanical coupling and magneto-piezoelectric coupling is developed;

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