Simulate the MEMS thick-resist physical lithography process, and use the physical simulation algorithm and physical model to accurately reflect the SU8 and other thick-resist lithography effects. ◆ Support the four-step simulation of image forming, exposure, post-baking, and development; ◆ Precise lighting model before and after exposure; ◆ Support multi-layer mask file layout settings; ◆ Support fine measurement of 3D display results.
精准的三维工艺物理模拟工具。 ◆ 模拟工艺流程生成的器件的三维模型,动画形式显示工艺过程； ◆ 支持绝大多数MEMS工艺仿真，包括：各向同性/异性淀积，各向同性/异性刻蚀，湿法刻蚀，键合，光刻以及CMOS工艺中的氧化/注入等； ◆ 高精度模式和快速模式两种仿真模式可选； ◆ Si DRIE和湿法各向异性刻蚀算法源自成熟的单工艺仿真算法模块，历经丰富的实践验证； ◆ 支持III-V族半导体(InP)等多种化合物半导体物理仿真工艺. ◆ 支持spray准各向同性湿法刻蚀工艺 ◆ 基于GPU大规模并行计算 ◆ 采用体素绘制技术，支持旋转、平移、缩放、剖面等功能 ◆ 支持按工艺分层显示，方便观察器件内部结构信息； ◆ 支持PPT、AVI、JPG等多种格式输出。
Powerful process demonstration tool based on 3D voxel manipulation. ◆ Display the technological process in the form of animation; ◆ Simulate the 3D model of the device after any process step; ◆ Support most MEMS process simulations, including: isotropic/anisotropic deposition, isotropic/anisotropic etching, wet etching, bonding, photolithography, and oxidation/implantation in CMOS processes; ◆ Using voxel graphics technology, more realistic demonstration of three-dimensional complex device structure; ◆ Using volume rendering technology, users can view the internal information of the device through functions such as rotation, translation, zoom, and section; ◆ Use geometric algorithms to simulate deposition and etching processes more realistically;
The advanced, automatic control-based unit etching simulation technology can obtain accurate <100>, <110> single crystal silicon wafer KOH and TMAH anisotropic etching simulation results, and can also be used for complex layout and long-term etching. ◆ Top, bottom and double-sided etching of wafers; ◆ Multiple cut-off layers and multiple etchings of different masks on a single wafer; ◆ Reflect the impact of misaligned masks, and compensation techniques; ◆ Predict the influence of etchant temperature, concentration and etching time on device shape; ◆ TMAH and KOH etching rate database, users can also customize the etching rate; ◆ To measure the effect of vertical etching in the case of coupled anisotropic etching; ◆ Three-dimensional graphics and cross-section visualization; ◆ Measure the distance and angle between any two points of the wafer after etching;
◆ Accurate wet etching process simulation based on atomic model; ◆ Integrate DRIE and multiple mask compounding process functions; ◆ Cellular automata and dynamic Monte Carlo model based on octree and parallel computing; ◆ Complete etching process database, user-oriented open interface; ◆ Can define and cut any high-index crystal plane; ◆ Accurate description of corrosion surface morphology; ◆ Compatible with IntelliMask layout file and Bmp mask file; ◆ Output FEM grid data; ◆ IntelliEtchG based on GPU massively parallel computing; ◆ Wagon Wheel Analyzer silicon etch rate extraction tool; ◆ Etch Rate Visualizer / CCA calibrator Silicon etch rate visualization and calibration tool; ◆ Wagon Wheel Analyzer II Quartz Etch Rate Extraction Tool;
The process flow of the device is created by combining materials and layouts, and can be output to the FabSim module to generate a 3D virtual model, which is output to the TEM module for analysis. ◆ Complete MEMS process flow, including deposition, photolithography, etching, bonding, electroplating and other processes. Users can add their own crafts; ◆ Support standard MEMS process, such as MUMPS, SCREAM, SUMMIT, LIGA, Bosch Surface Micromachining, etc. ◆ Users can create their own crafts; ◆ Anisotropic wet etch rate display and tuning tool for patterned silicon and quartz materials ◆ Support SOI material, support the synchronization of resistivity and sheet resistance parameters; ◆ Support the output of Excel format process flow sheet ◆ The 3D model of the device generated by simulating the process flow with FabSim; ◆ Combine the influence of TEM analysis on the device to achieve more accurate multi-physics simulation;
The most comprehensive thin-film material database and process optimization tool available today, providing a vital link between process parameters and device characteristics. ◆ Contains more than 70 kinds of MEMS film material properties commonly used based on real process, making the simulation results more accurate; ◆ Allow users to add and customize materials; ◆ Directly export material properties to TEM analysis module through IntelliFab module; ◆ Optimize the process;
Simulate the RIE/ICP (Bosch Process) process to clearly reflect how the processing process affects the product formation. ◆ Adjustable side scallops, roughness and period; ◆ The lag effect of RIE and DRIE; ◆ Simulate the shape and side angle of the final entity; ◆ Consider the effect of mask; ◆ Create structures with adjustable process parameters for specific sections; ◆ Support Footing effect simulation; ◆ Support process parameter calculation; ◆ DRIE etching rate and aspect ratio calibration tool;
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