The lntelliSuite software can not only analyze the impact of key etching processes on the device structure, but also analyze the second-order effects that affect the performance of MEMS devices, analyze the impact of packaging on device performance, and establish meshing models based on process simulation models.

Second-Order Effects Analysis

1. Accurately analyze the influence of material properties on device temperature performance 

2. Predict the device deformation caused by the stress or stress gradient of the multilayer thin film material 

Analyze the impact of packaging on device performance

1. The following is the packaging analysis of the gyro device 

2. The computing power of millions of nodes 

Automatic meshing

1. Use the process simulation model to establish a mesh model 

2. One-click 3D mesh creation 

With ParameterAnalysis, you can build a 3D mesh model with one click, and realize automatic boundary and load addition. The final result report can extract the results under any specified parameters.