It can perform thermal, electrostatic, mechanical, thermal-mechanical-electrical coupling, and fluid-structure coupling analysis in different types of static, dynamic, transient and frequency domains. ◆ Finite element and boundary element solvers; ◆ Compatible with ANSYS, PATRAN, IDEAS; ◆ Use IntelliFab module to generate finite element model or use 3DBuilder to generate 3D model of components; ◆ Define the stress gradient and add the Coriolis force to the cyclotron; ◆ Include the relationship between thermal conductivity, resistivity, thermal expansion coefficient, density and temperature; ◆ Contact analysis, piezoelectric, piezoresistive and packaging analysis; ◆ Accurate dynamic analysis of electromechanical coupling to realize dynamic electromechanical coupling simulation based on real 3D device structure; ◆ Piezoelectric transient and dynamic simulation include transient voltage differential input, transient charge density input and the influence of Squeeze Film; ◆ Eigenfrequency analysis; ◆ Capacitance matrix calculation; ◆ The complete finite element model can be obtained by a reduction method to a simplified model, which can be used for system level analysis. This reduction method is based on Arnoldi reduction method, Lagrangian mechanics and mode superposition; ◆ Macro model feature extraction, automatically generate N degrees of freedom system model. Completely record nonlinear dynamic behavior, including harmonic and sub-harmonic responses; ◆ Provide 32- and 64-bit solvers, support SMP multi-core parallel computing; ◆ Static calculation of thermoelectromotive force Seebeck effect; ◆ Static, frequency and dynamic analysis and calculation of magnetostrictive effect.

Customizable parametric analysis tools, from layout generation, 3D model meshing, boundary and load settings, to analysis and post-processing, to generate analysis reports. ◆ Unattended parametric analysis; ◆ Size parameterization; ◆ Load parameterization; ◆ Standard unit layout library; ◆ Customizable units and layouts; ◆ One-click 3D grid establishment; ◆ Automatic boundary and load addition; ◆ The final result report can extract the result under any specified parameter; ◆ It can generate a comparison chart of the results under different parameters;

Electromagnetic field analysis module ◆ MEMS accurate full wave analysis; ◆ Real deformation structure analysis; ◆ Adopt the internationally popular finite element analysis solver; ◆ Precise boundary condition settings; ◆ Automatic air filling; ◆ Powerful adaptive tetrahedron division; ◆ Rich electromagnetic material library; ◆ A choice of matrix equation solvers, including CG and GMRES; ◆ Support multi-core parallel computing; ◆ Extraction of S parameters; ◆ Extraction of impedance matrix; ◆ Three-dimensional display of electric field and magnetic field; ◆ Smith chart; ◆ Support other relevant industrial formats (such as ACIS text format); ◆ The data format is compatible with other modules of IntelliSuite;

Analysis of Microfluidics ◆ Microchannel flow; ◆ Electrically driven flow (electroosmosis, electrophoresis); ◆ Dielectrophoresis (two-dimensional electrophoresis); ◆ Ion-driven flow in electric field; ◆ Electrowetting (electric field droplet surface tension driven simulation), free surface flow; ◆ Define sliding boundary conditions to simulate plug flow; ◆ Mixing and separating flow of acid, alkali and weak electrolyte under the action of electric field; ◆ Convective heat transfer effect; ◆ Using block-fitted coordinates, it can accurately describe complex geometric models and solve the problem of moving boundaries;