The new solution does not have an etching rate parameter, and the etching rate in the parameter library is different from the actual one. How to determine the etching rate and improve the accuracy of simulation? The company's developed WWA (Wagon Wheel Analyzer) method can help you solve it.
The WWA method calibrates the etching rate through a combination of software and wet etching experiments. Using the WWA chip we provide, the chip is placed in a wet etching solution, and the images taken before and after etching are compared to determine the amount of retraction of each spoke caused by wet etching. The corresponding etching rate for vertical walls (different surface orientations) can be determined. By combining the etching rates of different crystal orientations, the overall etching rate can be derived, enabling comprehensive calibration.

DRIE on silicon wafers

Morphology after wet etching

Calibration process, using WWA to automatically extract the etching rate of micro mechanical wheels

In addition to silicon materials, complex quartz materials can also use the same method.

X. Vertical wheels on Y, BT, and NT (50.5) quartz chips

湿法刻蚀后

Calibration process, using WWA to automatically extract the etching rate of micro mechanical wheels

WWA chip

For more information, please call 025-66621998/66621988